Muhlbauer TTS300 Thermode
This is used to thermode bond a SMD component to a printed circuit by applying pressure and temperature to the top and bottom of the components
This is used to thermode bond a SMD component to a printed circuit by applying pressure (0.29N – 10.83N) and curing temperature (~160) to the top and bottom of the component(s) and printed substrate. This is to create an electrical connection between the SMD component and printed circuit using conductive adhesives like ACP245.
