LPKF – Laser Directed Structuring Tool
A three stage electroless plating process for producing laser patterned electroless copper circuitry on 3D substrates
The LPKF is a three stage laser directed electroless copper plating process. 3D printed or injection moulded parts are spray coated with a catalytic seed lacquer. The lacquered parts are then selectively laser activated. The laser structured parts are then electroless plated with copper to produce conformal copper circuitry. The laser directed structing tool can produce laser track widths down to 150 µm with a 100 x 100 mm maximum working area. The electroless plating process can produce plated copper with a sheet resistance down to 100 mΩ/□
