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Equipment

EVG610 Mask Aligner

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Manual handling and exposure of 4 inch square and 6 inch round substrates with manual alignment.

  • Manual mask load.
  • Proximity, soft and hard contact and vacuum contact modes.
  • Nominal resolution from 0.5 microns (dependant on mode and resist system).
  • Supports Nano-imprint exposure
  • Optical filter for Su8 exposure
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